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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.

12/28/2020 2:12:58 PM

Part List

BildTillverkarens artikelnummerBeskrivningAvailable QuantityPrisVisa detaljer
CONN SPRING MOD 25POS SMD3800520001CONN SPRING MOD 25POS SMD49 - Immediate$927.99Visa detaljer
CONN SPRING MOD 51POS SMD3800520013CONN SPRING MOD 51POS SMD0 - Immediate$693.25Visa detaljer
CIN::APSE STACKING HARDWRE 25POS3180299353CIN::APSE STACKING HARDWRE 25POS0 - ImmediateSee Page for PricingVisa detaljer
CIN::APSE STACKING HARDWRE 51POS3180299356CIN::APSE STACKING HARDWRE 51POS0 - ImmediateSee Page for PricingVisa detaljer
CABLE FFC/FPC 25POS 0.64MM 3"4631533093CABLE FFC/FPC 25POS 0.64MM 3"7 - Immediate$177.28Visa detaljer
CABLE FFC/FPC 51POS 0.64MM 3"4631533094CABLE FFC/FPC 51POS 0.64MM 3"0 - ImmediateSee Page for PricingVisa detaljer

Related Product Highlight

CIN::APSE Stacking Connector Jumpers Cinch Connectivity’s CIN:APSE stacking connectors are designed for coplanar and angled board-to-board applications.

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