Tflex SF10 Thermal Gap Filler

Product Highlights > Tflex SF10 Thermal Gap Filler

            Tflex SF10 Thermal Gap Filler
                    Laird's  high-performing non-silicone gap filler is extremely soft and exhibits very low pressure on components
    

Image of Laird's Tflex SF10 Thermal Gap Filler Laird's Tflex SF10 thermal gap filler is a high-performing, non-silicone product that is also extremely soft and exhibits very low pressure on components. Tflex SF10 is an innovative high-performing thermal material in Laird’s gap filler portfolio. The silicone-free material measures 10 W/mk and has excellent deflection properties which provide minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.

Features

High thermal conductivity
Low shore harndness value
Deflects easily with minimal pressure
Silicone-free formulation
Low peak and residual pressure

Naturally tacky
Excellent surface wetting for low contact resistance
Exceptionally low thermal resistance
UL94 V0
RoHS and REACH compliant

Applications

Automotive ADAS
Automotive electronics
Automotive infotainment
Gaming systems
Tablets/notebooks

Routers
Servers
Smart home devices
Wireless infrastructure