No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Jar, 8.8 oz (250g)
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NC191LTA250

DigiKey Part Number
315-NC191LTA250-ND
Manufacturer
Manufacturer Product Number
NC191LTA250
Description
SMOOTH FLOW LOW TEMP SOLDER PAST
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Jar, 8.8 oz (250g)
Datasheet
 Datasheet
Product Attributes
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Category
Flux Type
No-Clean
Manufacturer
Chip Quik Inc.
Mesh Type
4
Series
Form
Jar, 8.8 oz (250g)
Packaging
Bulk
Shelf Life
12 Months
Part Status
Active
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Composition
Bi57Sn42Ag1 (57/42/1)
Base Product Number
Melting Point
279°F (137°C)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 0
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All prices are in SEK
Bulk
QuantityUnit PriceExt Price
1kr 528,68000kr 528,68
Manufacturers Standard Package
Unit Price without VAT:kr 528,68000
Unit Price with VAT:kr 660,85000