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Product Overview
Digi-Key Part Number 294-1101-ND
Quantity Available
Manufacturer

Manufacturer Part Number

BDN14-3CB/A01

Description HEATSINK CPU W/ADHESIVE 1.41"SQ
Expanded Description Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 12 Weeks
Documents & Media
Datasheets Various Semiconductor Heat Sink
A01 Laminating Adhesive
RoHS Information BDN Series RoHS Cert
Catalog Page 2403 (EU2011-EN PDF)
Product Attributes Select All
Categories
Manufacturer

CTS Thermal Management Products

Series BDN
Part Status Active
Type Top Mount
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method Thermal Tape, Adhesive (Included)
Shape Square, Pin Fins
Length 1.410" (35.81mm)
Width 1.410" (35.81mm)
Diameter -
Height Off Base (Height of Fin) 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 5.6°C/W @ 400 LFM
Thermal Resistance @ Natural 16.2°C/W
Material Aluminum
Material Finish Black Anodized
 
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Additional Resources
Standard Package ? 1 000
Other Names 294-1101
BDN143CB/A01

00:55:33 3-29-2017

Price & Procurement
 

Quantity
All prices are in SEK.
Price Break Unit Price Extended Price
1 23,39000 23,39
10 22,75800 227,58
25 22,14560 553,64
50 20,91440 1 045,72
100 19,68330 1 968,33
250 18,45328 4 613,32
500 17,83810 8 919,05
1 000 15,99270 15 992,70
5 000 15,68516 78 425,80

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